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Cher Ming Tan

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Applications of finite element methods for reliability studies on ULSI interconnections
Microelectronic yield, reliability, and advanced packaging
Electromigration Modeling at Circuit Layout Level
Electromigration Modeling at Circuit Layout Level
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Theory and Practice of Quality and Reliability Engineering in Asia Industry
Microelectronic Yield, Reliability, and Advanced Packaging (Proceedings of Spie)
Electromigration in ULSI Interconnections
Reliability Analysis of Electrotechnical Devices
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Theory and Practice of Quality and Reliability Engineering in Asia Industry
Theory and Practice of Quality and Reliability Engineering in Asia Industry