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G. S. Mathad

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Plasma etching processes for sub-quarter micron devices
Interconnect and contact metallization for ULSI
Proceedings of the symposia on reliability of semiconductor devices/interconnections and dielectric breakdown, and laser process for microelectronic applications
Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7
Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB
Copper Interconnects, New Contact Metal- Lurgies, & Low-k Dielectrics
Highly Selective Dry Etching and Damage Control (Advances in Soil Science)