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Jeffrey C. Suhling

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Stand Alone

Encyclopedia of Packaging Materials, Processes, and Mechanics - Set 1: Die-Attach and Wafer Bonding Technology (a 4-Volume Set)
Interconnect and Wafer Bonding Technology
Encyclopedia of Packaging Materials, Processes, and Mechanics Interconnect and wafer bonding technology. Set 1
Proceedings of the ASME InterPack Conference--2009 Presented at 2009 ASME InterPack Conference : July 19-23, 2009, San Francisco, California, USA
Proceedings of the ASME Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS, and NEMS--2011 Presented at ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS, and NEMS : July 6-8, 2011, Portland, Oregon, USA.