Author Description

<p><b>A systematic guide to the theory, applications, and design of thermal management for LED packaging</b> <p>In <i>Thermal Management for Opto-electronics Packaging and Applications</i>, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. <p>The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. <p>The book also includes: <ul><li>A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials </li><li>Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling</li> <li>Practical discussions of thermally enhanced thermal interfacial materials (TIMs)</li> <li>Complete treatments of hybrid thermal management in downhole devices</li></ul> <p>Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, <i>Thermal Management for Opto-electronics Packaging and Applications</i> will also benefit advanced students focusing on the design of LED product design.