Author Description

Volume is indexed by Thomson Reuters CPCI-S (WoS).The papers were selected for this volume on the basis of their quality and relevance to the topic of abrasive technology. The volume presents the reader with recent advances in the field of abrasive technology; including the mechanics and control of abrasive processes, modeling, simulation and optimization of abrasive processes, green and clean production in abrasive processes, measurement and surface-quality assessment, cooling and coolants, polishing, wheel-truing and dressing, novel abrasive techniques and novel machining techniques. It will therefore be of great value to production and research engineers, research students and academics working in the field. The biennial conference used to be called the Grinding and Machining Conference in China. Just over 100 selected and peer-reviewed papers consider such aspects as the workpiece surface residual stress in high-efficiency deep grinding and ultra-high wheel speeds, the three-dimensional simulation of wheel topography, lubricating behavior in chemical mechanical polishing, abrasive water jet polishing technology, the dynamic grinding force in ultrasonic honing chatter, and China's diamonds in the world market.