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Y.C. Lee

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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging
Manufacturing Challenges in Electronic Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging
Y.C. Lee — Books & Biography | Menrva Books