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John H. Lau

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Microvias
Reliability Of Rohscompliant 2d And 3d Ic Interconnects
Chip on board technologies for multichip modules
Electronics manufacturing
Handbook of fine pitch surface mount technology
Electronic packaging
Chip scale package (CSP)
Advanced MEMS Packaging
Reliability of RoHS-Compliant 2D and 3D IC Interconnects
Second Skin The Screenplay
Handbook Of Tape Automated Bonding
Fan-Out Wafer-Level Packaging
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
Semiconductor Advanced Packaging
Ball Grid Array Technology

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