Author Description

A summary of progress in ball grid array (BGA) packaging technology, for professionals in BGA research and development, and for manufacturers researching BGA for their interconnect systems. Discusses economic, design, material, process, and quality issues, and describes techniques for processing substrates, routing PCB, assembling CBGA, PBGA, and TBGA packages, and inspection of BGA PCB assemblies. Includes treatment of BGA industry infrastructure, and an electronic packaging glossary. Contains b&w photos and diagrams. Annotation copyright Book News, Inc. Portland, Or.