Ibrahim (Abe) M. Elfadel profile picture

Ibrahim (Abe) M. Elfadel

3D Stacked Chips
Machine Learning in VLSI Computer-Aided Design
VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence
3D Stacked Chips From Emerging Processes to Heterogeneous Systems
VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence
The IoT Physical Layer
Tapered Beams in MEMS: A Symbolic Modeling Framework with Applications to Energy Harvesting
Machine Learning in VLSI Computer-Aided Design
MEMS Accelerometers
VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things: 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23–25, 2017, Revised and Extended Selected Papers
Secure, Low-Power IoT Communication Using Edge-Coded Signaling
The IoT Physical Layer Design and Implementation
VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23–25, 2017, Revised and Extended Selected Papers
3D Stacked Chips From Emerging Processes to Heterogeneous Systems
Secure, Low-Power IoT Communication Using Edge-Coded Signaling

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