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Ibrahim (Abe) M. Elfadel

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3D Stacked Chips
Machine Learning in VLSI Computer-Aided Design
VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence 31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16–18, 2023, Revised Extended Selected Papers
3D Stacked Chips From Emerging Processes to Heterogeneous Systems
Secure, Low-Power IoT Communication Using Edge-Coded Signaling
VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence
The IoT Physical Layer Design and Implementation
The IoT Physical Layer
Tapered Beams in MEMS A Symbolic Modeling Framework with Applications to Energy Harvesting
Machine Learning in VLSI Computer-Aided Design
MEMS Accelerometers
VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23–25, 2017, Revised and Extended Selected Papers
3D Stacked Chips From Emerging Processes to Heterogeneous Systems
Secure, Low-Power IoT Communication Using Edge-Coded Signaling
The IoT Physical Layer Design and Implementation

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Ibrahim (Abe) M. Elfadel — Books & Biography | Menrva Books | MenrvaBooks