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King-Ning Tu

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Electronic Packaging Science and Technology
Kinetics in Nanoscale Materials
Electronic Packaging Science and Technology
Electronic Packaging Materials Science Symposium Held November 27-29, 1984, Boston, Massachusetts, U.S.A.
Understanding the Reliability Technology Based on Entropy Production, and Other Researches
Kinetics in Nanoscale Materials
Electronic Thin-Film Reliability
Elements of Electromigration Electromigration in 3D IC technology
Kinetics in Nanoscale Materials
Solder Joint Technology Materials, Properties, and Reliability
Solder Joint Technology Materials, Properties, and Reliability
Silicon and Silicide Nanowires Applications, Fabrication, and Properties