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Xing-Chang Wei

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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
Modeling and Design of Electromagnetic Compatibility for High-speed Printed Circuit Boards and Packaging
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging