
The IEMT symposium provides a forum for sharing experiences and knowledge based on microelectronic research and development. This volume is the result of the 1997 symposium and topics include: flip chip and TAB, substrate, soldering process, manufacturing, and packaging technology.
Page Count:
504
Publication Date:
1993-01-01
Publisher:
IEEE
ISBN-10:
0780314263
ISBN-13:
9780780314269
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