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5.2.3 Meander Line-Resonator Hybrid Structure -- 5.2.3.1 Basic Hybrid Structure -- 5.2.3.2 Compensation Strips -- 5.2.3.3 Measurement Results -- 5.3 PCB-Embedded Structure -- 5.3.1 PCB-Embedded Filter -- 5.3.1.1 Structure of Embedded Filter -- 5.3.1.2 Modeling of Embedded Filter -- 5.3.1.3 Tunable Isolation Band -- 5.3.2 PCB-Embedded Absorber -- 5.3.2.1 Absorbing Material for Noise Reduction in PDN -- 5.3.2.2 Validation -- References -- 6: Interposer Electromagnetic Compatibility Design -- 6.1 Double-Shielded Interposer -- 6.1.1 Double-Shielded Interposer and Its Equivalent Circuit -- 6.1.1.1 Double-Shielded TSV Interposer -- 6.1.1.2 Equivalent Circuit Model -- 6.1.2 Signal Propagation Analysis -- 6.1.2.1 Insertion Loss -- 6.1.2.2 Electric Field Distribution Inside the Interposers -- 6.1.2.3 Dielectric and Metal Losses -- 6.1.3 Design Guidelines -- 6.1.3.1 Characteristic Analysis of Highly Doped Silicon Thickness -- 6.1.3.2 Characteristic Analysis of Highly Doped Silicon Area -- 6.1.3.3 Characteristic Analysis of a Meshed Pattern -- 6.1.4 Conclusion -- 6.2 Compact Integrated Waveguide -- 6.2.1 TE-Mode Waveguide -- 6.2.1.1 Compact Waveguide Structures -- 6.2.1.2 Propagation Characteristics and Electric Field Distribution -- 6.2.2 Quasi-TEM-Mode Waveguide -- 6.2.3 Conclusion -- References -- 7: New Structures and Materials -- 7.1 High-Impedance Surface -- 7.1.1 Basic of HIS -- 7.1.1.1 Mushroom-Type HIS -- 7.1.1.2 Cavity-Type HIS -- 7.1.2 Applications of HIS -- 7.1.2.1 Shielding Box -- 7.1.2.2 Antenna Design -- 7.1.3 Conclusion -- 7.2 Graphene -- 7.2.1 Electromagnetic Characterization -- 7.2.1.1 Fabrication of Graphene Film -- 7.2.1.2 Equivalent Circuit of Graphene Film -- 7.2.1.3 Measurement Results -- 7.2.1.4 Conclusion -- 7.2.2 Absorber