
This symposium pictures the future state of the electronics packaging which impacts the infrastructures of 5G and B5G The symposium also tries to predict where the packaging technology is heading The symposium will emphasize the following main topics Photonics, Advanced Packaging, Power Electronics, Automotive, Bioelectronics, and Healthcare to discuss about the technologies on Electronics Packaging for new generation of DX in Metaverse and wellbeing
Page Count:
0
Publication Date:
2022-11-09
Publisher:
IEEE
ISBN-10:
1665486147
ISBN-13:
9781665486149
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