Proceedings, 1995 IEEE Multi-Chip Module Conference, January 31-February 2, 1995, Santa Cruz, California
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Author Description
The IEEE Multi-Chip Module Conference (MCMC) brings together elements of packaging technology and design, circuits and system design, computer-aided design, modeling, analysis, and education. The proceedings of MCMC'95 comprise papers and posters on manufacturing issues, applications, field programm
Page Count:
233
Publication Date:
1994-01-01
Publisher:
IEEE Computer Society Press
ISBN-10:
0818669705
ISBN-13:
9780818669705