This handbook provides a comprehensive overview of packaging principles and practices relevant to the electronics industry. It details the critical considerations for designing and implementing effective packaging solutions to protect sensitive electronic components during manufacturing, shipping, and storage. The Intel Corporation, a leader in semiconductor technology, compiled this guide to standardize and advance packaging methodologies within its operations and for its partners.

This handbook is recognized as a foundational technical reference within the electronics manufacturing and packaging industry. Its detailed approach to material science, design, and testing provides engineers and supply chain professionals with actionable insights. The Intel Corporation's authority in semiconductor technology lends significant weight to the methodologies and recommendations presented.