12th International Electronic Manufacturing Technology Symposium April 1 - 3, 1992, Mainz, Germany
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Author Description
The IEMT symposium provides a forum for sharing experiences and knowledge based on microelectronic research and development. This volume is the result of the 1997 symposium and topics include: flip chip and TAB, substrate, soldering process, manufacturing, and packaging technology.
Page Count:
370
Publication Date:
1992-01-01
Publisher:
Inst. of Electr. and Electronics Engineers
ISBN-10:
0780306295
ISBN-13:
9780780306295