Author Description

Proceedings of the ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida. Collection of 30 full-length, peer-reviewed technical papers on the following major topic areas: Mechanics of SMT and photonic structures; Alternatives to lead solder: views, concerns, and issues for use in military electronics and other harsh environments-technical advances in lead-free interconnection technologies; research and technological advances in wafer and elecctronic manufacturing: slicing of silicon wafers, lithium niobate, piezoelectric materials, chem-mechanical polishing (CMP) and planarization to prepare wafers for micro-electronics fabrication; cooling challenges in electronic packaging. By: G.J. Kowalski et. al